3D BGA Reballing Stencil for iPhone 6-13 Pro Max Hard Disk NAND Template Soldering Net A15-A8
3D BGA Reballing Stencil dedicate kit for A12 A11 A10 A9 A8
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3D BGA Reball Stencil Kits A8 A9 A10 A11 A12 A13 A14 A15 Solder tin plate for iPhone 3D BGA planting Stencil
1.3D design,0.25mm thickness extra hard steel.
2.Stepped design grooves catch IC accurately and easily.
3.Each single slot has the same size as phone IC.
4.Full models for A8-A15 IC repair.
5.Easy to use and work efficiently.
6.This 3D BGA reball stencils can location the IC chip when you repair, it's so convenient. Stable, and accurately. No need IC holder station.
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